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Download Final Program: info on registration, technical program, hotel & social program

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3 Days Technical Program Download

Preview Abstracts

Modeling I                

1.1              An Analysis of the Scale Dependent and Quantum Effects on Electrical Contact Resistance Between Rough Surfaces

Robert Jackson, Auburn University, United States; Erika Crandall, Auburn University, United States; and Michael Bozack, Auburn University, United States

1.2       Phenomena at Arc Root Immobility in Electrical Contacts

                Stanislav Kharin, Kazakh-British Technical University, Kazakhstan; Hassan Nouri, University of the West of England, United Kingdom; and Bogdan Miedzinski, Wroclaw University of Technology, Poland

1.3       The Influence of Thermal Expansion and Plastic Deformation on a Thermo-Electro Mechanical Spherical Asperity Contact

                Hamed Ghaednia, Auburn University, United States; Robert Jackson, Auburn University, United States; and Amir Rostami, Auburn University, United States

 

Young Investigator Award          

2.1       Quantitative Evolution of Electrical Contact Resistance Between Aluminum Thin Films

            David Mercier, CEA - LETI, France; Vincent Mandrillon, CEA - LETI, France; Anthony Holtz, CEA - LETI, France; Fabien Volpi, SIMaP, France; Marc Verdier, SIMaP, France; and Yves Brechet, SIMaP, France

2.2       Characterization of Intermetallic Compounds in Al-Cu Bimetallic Interfaces

            Stephanie Pfeifer, Technische Universität Dresden, Germany;Steffen Großmann, Technische Universität Dresden, Germany; Renate Freudenberger, Forschungsinstitut für Edelmetalle und Metallchemie, Germany; Heidi Willing, Forschungsinstitut für Edelmetalle und Metallchemie, Germany; and Herbert Kappl, Forschungsinstitut für Edelmetalle und Metallchemie, Germany

2.3       Principle of Arc Fault Detection for Solid State Power Controller

Jonathan Andrea, Esterline Power Systems, France; Marc Bournat, Esterline Power Systems, France; and Olivier Zirn, Esterline Power Systems, France

2.4       Breakdown Electric Field Calculation of Hot SF6 and its Application to High Voltage Circuit Breakers

Xingwen Li, Xi'an Jiaotong University, China; Hu Zhao, Xi'an Jiaotong University, China; Xu Jiang, Xi'an Jiaotong University, China; Shenli Jia, Xi'an Jiaotong University, China; and Qian Wang, Xi'an Jiaotong University, China

2.5       Contact Bounce Phenomena in a MEM Switch

Alexis Peschot, CEA, LETI, France; Christophe Poulain, CEA, LETI, France; Nelly Bonifaci, CNRS, France; and Olivier Lesaint, CNRS, France

 

Connectors

3.1       Evaluation of Crimping as a Termination Technique for Carbon Nanotube Macro-structures

            Jessica Hemond, TE Connectivity, United States; Rod Martens, TE Connectivity, United States; and Andrew Loyd, TE Connectivity, United States

3.2       The Effect of Wiping Distance on Contact Performance

            Xue-Yan Lin, Research Laboratory of Electrical Contacts and Connectors, China; Da Wang, Beijing University of Posts and Telecommunications (BUPT), China; Hui-Juan Long, Beijing University of Posts and Telecommunications (BUPT), China; and Xiao-Lan Ye, Beijing University of Posts and Telecommunications (BUPT), China

3.3       Novel Helical Spring Contact for Low Force & Fine Pitch Applications

                Gregory Pawlikowski, TE Connectivity, United States; and Jeffery Mason, TE Connectivity, United States

 

Testing and Characterization

4.1       Selection Criteria for Residential Aluminum Connections

            Jesse Aronstein, Consulting Engineer, United States; and Doug Lee, U.S. Consumer Product Safety Commission, United States

4.2       Novel Reflectometry Method Based on Time Reversal for Cable Aging Characterization

                Lola El Sahmarany, CEA-LIST Nano-Innov, France; Fabrice Auzanneau, CEA-LIST Nano-Innov, France; and Pierre Bonnet, Blaise Pascal University, France

4.3       An Experimental Study on Contact Resistance Characteristics of Relay Contacts Operated in the Vicinity of New Telechelic Polyacrylate Polymers

Makoto Hasegawa, Chitose Institute of Science and Technology, Japan; and Keisuke Takahashi, Chitose Institute of Science and Technology, Japan

 

Arc Fault Safety

5.1       Application of (Motor Protection) Circuit Breakers in Combination with Variable Frequency Drives (VFD)

            Hans Weichert, Rockwell Automation AG, Aarau, Switzerland; Pascal Benz, Rockwell Automation AG, Aarau, Switzerland; and Sandro Liberto, Rockwell Automation AG, Aarau, Switzerland

5.2       Diagnostic of Connector's Degradation Level by Frequency Domain Reflectometry

                Florent Loete, LGEP-SUPELEC, France; and Cedric Gilbert, LGEP-SUPELEC, France

5.3       Modeling of a Domestic Electrical Installation to Arc Fault Detection

                Jinmi Lezama, Université de Lorraine - Hager Electro SAS, France; Patrick Schweitzer, Université de Lorraine, France; Serge Weber, Université de Lorraine, France; Etienne Tisserand, Université de Lorraine, France; and Patrice Joyeux, Hager Electro SAS, France

 

Contact Finish I     

6.1       The Effects of Lubrication on Electroplated Tin Surfaces: A Systematic Approach by DOE-Methodology

            Frank Ostendorf, Weidmueller Interface GmbH Co. KG, Germany; Thomas Wielsch, Weidmueller Interface GmbH Co. KG, Germany; and Michael Reiniger, Weidmueller Interface GmbH Co. KG, Germany

6.2       Graphene Films for Corrosion Protection of Gold Coated Cuprous Substrates in View of an Application to Electrical Contacts

            Sophie Noel, Supelec, France; Laurent Baraton, Supelec, France; David Alamarguy, Supelec, France; Alexandre Jaffre, Supelec, France; Pascal Viel, CEA, France; and Serge Palacin, CEA, France

6.3       New Corrosion Resistant Plating to Reduce Gold Consumption in Connectors

                George J. S. Chou, TE Connectivity, United States

6.4       Whisker Prevention Using Hard Metal Cap Layers

            Erika Crandall, Auburn University, United States; George Flowers, Auburn University, United States; Pradeep Lall, Auburn University, United States; and Michael Bozack, Auburn University, United States

 

Mort Antler Lecture

Computational materials science – From Atoms to Structures

Markus J. Buehler, MIT

 

Degradation           

7.1       Research on Accelerated Storage Degradation Testing for Aerospace Electromagnetic Relay

                Zhaobin Wang, Harbin Institute of Technology, China; Guofu Zhai, Harbin Institute of Technology, China; Wanbin Ren, Harbin Institute of Technology, China; Xiaoyi Huang, Harbin Institute of Technology, China; and Qiong Yu, Harbin Institute of Technology, China

7.2       Degradation Phenomenon of Electrical Contacts Using a Micro-Sliding Mechanism- Minimal Sliding Amplitudes Estimated Under Some Conditions by the Mechanism

                Shin-ichi Wada, TMC System Co. Ltd., Japan; and Koichiro Sawa, Nippon Institute of Technology, Japan

7.3       Reliability Study of Low Normal Force LGA Sockets

                Rod Martens, TE Connectivity, United States; Simon Li, TE Connectivity, China; Coosy Ding, TE Connectivity, China; and Nathan Norris, TE Connectivity, United States

 

Arcing Materials

8.1       Silver Tungsten VS Silver Tungsten Carbide Contact Performance in Environmental Testing

Chad Mittelstadt, Schneider Electric, United States

8.2       A study of contact endurance switching life as a function of contact bond quality, contact electrical load and residual stresses for silver tin indium oxide composite rivet contacts

                Zhuanke Chen, Chugai USA LLC, United States

8.3       Contact Material Combinations for High Performance Switching Devices

Timo Mützel, Umicore AG & Co. KG, Germany; and Ralf Niederreuther, Umicore AG & Co. KG, Germany

8.4       Effect of Ambient Temperature and Contact Force on Contact Resistance and Overtemperature Behaviour for Power Engineering Contacts

Volker Behrens, Doduco GmbH, Germany; Edgar Siegle, Doduco GmbH, Germany; Jonas Schreiber, Doduco GmbH, Germany; Thomas Honig, Doduco GmbH, Germany; and Michael Finkbeiner, Doduco GmbH, Germany

 

Fretting

9.1       Introduction of a "Modified Archard Wear Law" to Predict the Electrical Contact Endurance of Thin Plated Silver Coatings Subjected to Fretting Wear

            Siegfried Fouvry, Ecole Centrale de Lyon, France; Pawel Jedrzejczyk, Ecole Centrale de Lyon, France; Olivier Perrinet, Ecole Centrale de Lyon, France; Olivier Alquier, PSA, France; and Pierre Chalandon, PSA, France

9.2       Fretting Behavior of Au Plated Copper Contacts Induced by High Frequency Vibration

                Wanbin Ren, Harbin Inst. of Tech., China; Li Cui, G&A Technology Co., Ltd, China; Jinbao Chen, Harbin Inst. of Tech., China; Xiaoming Ma, Harbin Inst. of Tech., China; and Xinyun Zhang, Harbin Inst. of Tech., China

9.3       Sliding Performance of Electrical Contact Pairs with Inconsistently Thick Gold Plating

Yilin Zhou, Beijing University of Posts and Telecommunications, China; Chuan Hong, Beijing University of Posts and Telecommunications, China; Libiao Liu, Beijing University of Posts and Telecommunications, China; and Liangjun Xu, Beijing University of Posts and Telecommunications, China

 

Modeling II 

10.1     Finite Element Based Surface Roughness Study for Ohmic Contact of Microswitches

            Hong Liu, Institut Clément Ader, INSA, Univ de Toulouse; CNRS, LAAS; Univ de Toulouse, INSA, LAAS, France; Dimitri Leray, Institut Clément Ader, INSA, Univ de Toulouse; CNRS, LAAS; Univ de Toulouse, INSA, LAAS, France; Patrick Pons, CNRS, LAAS; Univ de Toulouse, LAAS, France; Stéphane Colin, Institut Clément Ader, INSA, Univ de Toulouse, France; and Adrien Broué, NOVAMEMS, c/o CNES; CNRS, LAAS ; Univ de Toulouse, LAAS, France

10.2     The Steady Temperature Rise Analysis of Non Segregated Phase Bus based on Finite Element Method

                Jiaxin You, Harbin Institute of Technology, China; Huimin Liang, Harbin Institute of Technology, China; Guangcheng Ma, Harbin Institute of Technology, China; Guoliang Li, Harbin Electric Machinery Co. LTD, China; and Guofu Zhai, Harbin Institute of Technology, China

10.3     Role of Metallic Vapor Pressure in Contact Bouncing and Welding at Closure of Electrical Contacts in Vacuum

            Stanislav Kharin, Kazakh-British Technical University, Kazakhstan

 

Fundamentals 

11.1     Current Density Analysis of Thin Film Effect in Contact Area on LED Wafer

                Shigeru Sawada, Mie Univ. Graduate School of Engineering, Japan; Shigeki Tsukiji, Mie Univ. Graduate School of Engineering, Japan; Shigeki Shimada, Sumitomo Electric Industries LTD., Japan; Terutaka Tamai, Elcontech Consulting, Japan; and Yasuhiro Hattori, Autonetworks Technologies Ltd., Japan

11.2     Contact Resistance Reduction by Matching Current and Mechanical Load Carrying Asperity Junctions

            Marjorie Myers, TE Connectivity, United States; Michael Leidner, TE Connectivity, Germany; Helge Schmidt, TE Connectivity, Germany; Soenke Sachs, TE Connectivity, Germany; and Alexander Baeumer, TE Connectivity, Germany

11.3     Current Redistribution across an Aging Contact Interface

                Robert Malucci, RD Malucci Consulting, United States

 

Contact Finish II

12.1     Electrochemically Deposited Coating Systems on Aluminum for Contact Applications

                Stephanie Kissling, DODUCO GmbH, Germany; Wolfgang Schmitt, DODUCO GmbH, Germany; and Volker Behrens, DODUCO GmbH, Germany

12.2     Electrical Contact Resistance Presumption about Tin-Coated Copper-Alloy Contacts Using RF Sputtered SnOx Thin Films

                Keiji Mashimo, Furukawa Electric Co., Ltd., Japan; and Yasuyuki Ishimaru, FITEC Corp., Japan

12.3     The Influence of Surface Oxides on Whiskering

                Erika Crandall, Auburn University, United States; George Flowers, Auburn University, United States; Pradeep Lall, Auburn University, United States; Erica Snipes, Auburn University, United States; and Michael Bozack, Auburn University, United States

 

Arcing

13.1     Observation of Changes of Contact Surface Profiles of Ag and AgSnO2 Contacts During Switching Operations with an Optical Cross-Section Method

            Makoto Hasegawa, Chitose Institute of Science and Technology, Japan; Nanae Kobayashi, Chitose Institute of Science and Technology, Japan; Yoshiyuki Kohno, Kaneka Corporation, Japan; and Hiroshi Ando, Kaneka Corporation, Japan

13.2     Influence of Source Voltage on Various Characteristics of a Contactor Comparing Make Only, Break Only and Make and Break Arcs

                Kiyoshi Yoshida, Nippon Institute of Technology, Japan;Koichiro Sawa, Nippon Institute of Technology, Japan;Kenji Suzuki, Fuji Electric FA Components & Systems Co., Ltd., Japan;Hideki Daijima, Fuji Electric FA Components & Systems Co., Ltd., Japan; and Kouetsu Takaya, Fuji Electric FA Components & Systems Co., Ltd., Japan

13.3     High-Speed Spectroscopic Imaging of Contact Surfaces Eroded by Break Arcs

            Junya Sekikawa, Shizuoka University, Japan

13.4     A Type of Attractive Force Calculation Model of Polarized Relay Based on Nonlinear Permanent Magnet Bar Subsection Model

Huimin Liang, Harbin Institute of Technology, China; Jiaxin You, Harbin Institute of Technology, China; Weinan Xie, Harbin Institute of Technology, China; Guangcheng Ma, Harbin Institute of Technology, China; and Guofu Zhai, Harbin Institute of Technology, China

 

Sliding

14.1     Time Series Analysis in the Study of Sliding Electrical Contacts

                Christian Holzapfel, Schleifring und Apparatebau GmbH, Germany

14.2     Influence of Arc Discharge on Carbon Commutator and Brush Wear in DC Motor Driving Fuel Pump

                Koichiro Sawa, Nippon Institute of Technology, Japan; Liqing Liu, Nippon Institute of Technology, China; and Takahiro Ueno, Nippon Institute of Technology, Japan

14.3     Sliding Scar Analyses of High Speed Sliding Contact Characteristics of Cu-Sn Based Composite Materials Containing WS2

            Yoshitada Watanabe, Kogakuin University, Japan; and Ryohei Saito, Union Machinery Company, Japan

14.4     High Speed Data across Sliding Electrical Contacts

Glenn Dorsey, Moog, Inc., United States; Donnie Coleman, Moog, Inc., United States; and Barry Witherspoon, Moog, Inc., United States

 

Posted August 3, 2012

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Advance Announcement
58th IEEE Holm Conference on Electrical Contacts & Intensive Course
23-26 September 2012

Doubletree by Hilton, Portland, OR
Sponsored By:
The Components, Packaging, and Manufacturing Technology Society of the IEEE

Purpose:
To provide a forum for the presentation and discussion of the latest developments in the field of electric contacts including research on materials, contact and connector designs, and the applications of these designs in electric, electronic and telecommunication equipment.

For Whom:

Practicing designers, engineers, physicists and research scientists - those new to the field and those experienced.

The 2012 Holm Conference will include a proceeding given out at the beginning of the conference with more than 57 presentations by US and international engineers and scientists. This provides an opportunity to study papers of interest before the actual presentation and promote better question and answer discussion during the conference.  These papers and discussions of the papers provide the attendees with an up to date look at the research being done in the contact field.


Additionally, the conference provides a forum that allows attendees to meet and personally discuss the work of different authors and experts in the contact field.  These exchanges provide a synergistic environment for further advancements in the electrical contact field.


A COMPLETE ADVANCE PROGRAM ANNOUNCEMENT is attached in PDF Format.  Or to view online, please click

Posted June 4, 2012

 

 

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